Electronics component manufacturing scheme receives 249 applications: IT Ministry

“The Electronics Component Manufacturing Scheme (ECMS) has received applications for incentives in excess of the targets set by the Union Cabinet,” the Ministry of Electronics and Information Technology said on Thursday (October 2, 2025). As of September 30, which was the deadline for applying for incentives for most products under the ECMS’s remit, the IT Ministry has received applications with investment promises of ₹1,15,351 crore, while the target is just ₹59,350 crore.

The ECMS was unveiled in April as a complement to the India Semiconductor Mission, with an outlay of ₹22,919 crore, with output- and employment-linked incentive payouts to approved applicants. The scheme was announced as a way of encouraging the growth of components other than finished goods and semiconductor fabrication in India, to deepen the value chain of electronics manufacturing in India.

“Against a production target of ₹4,56,500 crore, we have received production estimates more than ₹10,34,000 crore” over the scheme’s six year tenure, IT Minister Ashwini Vaishnaw told presspersons. “[For] employment we have targeted 91,600 persons, but here the employment which is expected is one and a half times more at 1,41,000 persons.” 

“In view of the interest in the scheme — 249 applications in all, for making everything from printed circuit boards (PCBs) to so-called “sub-assemblies” in electronic goods — the government will disburse funds in a “first come first served” way, where approved companies that are able to gestate their businesses and get products into the market faster will receive incentive payouts,” said IT Secretary S. Krishnan. “Scrutiny has started for these applicants, and the Ministry “will fast track the approval process,” he said.

Mr. Vaishnaw declined to name any specific companies who have applied for incentives under this scheme (or their countries of origin), but said some firms had applied for incentives in manufacturing more than one type of component, something he said the government encouraged. “Electro-mechanicals” and “multi-layer PCBs” received the highest interest by number of applicants, 87 and 43 respectively. “One unnamed company committed around ₹22,000 crore,” the Ministry said.

“We’re planning to encourage materials also,” Mr. Vaishnaw said, alluding to the upcoming second phase of the India Semiconductor Mission, which the government said is under formulation, with “attractive response from industry.” The government has in recent months sought to expand the scope of its sops to electronics manufacturing from capital support to semiconductor packaging facilities and phone assembly units to other parts of the value chain.

While the application process has ended for nearly all products, the government is keeping a key one — capital goods, the heavy equipment used in facilities that are used in manufacturing — open until April 2027, in view of the time that this particular part of the industry takes to get established.